MDHYDS12B 12 inch dishing saw
MDHYDS12B precision dicing machine is equipped with 2.4kw high-power DC spindle; high-rigidity portal structure; θ-axis DD motor drive; maximum workpiece size can reach 310*310mm, suitable for cutting large package substrate materials, and the cutting efficiency is relatively single-axis model It can be increased by up to 90%
MDHYDS8FA 8 inch dishing saw
MDHYDS8FA precision dicing machine is equipped with 2.4kw high-power DC spindle; high-rigidity gate structure; θ-axis DD motor drive; imported high-precision lead screw and guide rail; dual lens alignment; software functions are further enhanced, and the degree of automation is significantly improved; Widely meet all kinds of processing needs
MDHYDS12FA 12 inch dishing saw
MDHYDS12FA is a 12-inch fully automatic precision dicing machine. This model realizes the automatic operation of wafer loading, alignment, cutting, cleaning and unloading. This model is equipped with high-power opposed dual-spindles. Both the Z1 and Z2 axes are equipped with NCS and special microscopes, which greatly reduces the alignment and inspection time, thereby reducing labor costs and improving production efficiency.
spindle rotary
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MDHYDS8FA |
MDHYDS12B |
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MDHYDS12FA |
Spec |
dicing size |
mm |
ф8”〡□250 |
ф12”〡□300 |
ф420”〡□360 |
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ф12”〡□275 |
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dicing depth |
mm |
≤4mm or custom |
≤4mm or custom |
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≤4mm or custom |
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Main |
speed |
minˉ¹ |
6000∽60000 |
6000∽60000 |
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6000∽60000 |
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power |
kW |
DC, 2.4at60000minˉ¹ |
DC, 2.4at60000minˉ¹ |
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DC, 2.4at60000minˉ¹ |
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X axis |
stroke |
mm |
260 |
310 |
450 |
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310 |
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speed range |
mm/s |
0.1∽600 |
0.1∽800 |
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0.1∽1000 |
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Y axis |
stroke |
mm |
260 |
170 |
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310 |
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resolution |
mm |
0.0001 |
310 |
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450 |
0.0001 |
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single move accuracy |
mm |
≤0.002/5 |
≤0.002/5 |
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≤0.002/5 |
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F accuracy |
mm |
≤0.005/260 |
≤0.005/310 |
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≤0.005/310 |
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Z axis |
stroke |
mm |
40 |
40 |
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40 |
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max blade size: |
mm |
ф58 |
ф58 |
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ф58 |
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resolution |
mm |
0.00005 |
0.00005 |
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0.00005 |
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accuracy |
mm |
0.001 |
0.001 |
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0.001 |
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R |
range |
deg |
380 |
380 |
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380 |
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Basic required |
power |
KVA |
4.0（three phase，AC380V） |
5.0（three phase，AC380V） |
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7.0（three phase，AC380V） |
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air |
Mpa L/min |
0.5∽0.6max consumption260 |
0.5∽0.6max consumption400 |
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0.5∽0.6max consumption550 |
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cutting fluid |
Mpa L/min |
0.2∽0.3max consumption4.0 |
0.2∽0.3max consumption7.0 |
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0.2∽0.3max consumption9.0 |
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cooling water |
Mpa L/min |
0.2∽0.3max consumption1.5 |
0.2∽0.3max consumption3.0 |
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0.2∽0.3max consumption3.0 |
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exhaust |
m³/min |
5.0 |
8.0 |
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8.0 |
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size |
mm |
900*1050*1800 |
1170*1030*1850 |
1380*1300*1850 |
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1200*1600*1800 |
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weight |
kg |
1050 |
1400 |
1550 |
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2000 |
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Features:
√ Integrated cutting and cleaning;
√ Standard non-contact height measurement function (NCS);
√ Optional tool mark detection function;
√ Optional blade breakage detection function (BBD);
√ Optional workpiece shape detection function;
√ Optional data scanning input function;
Equipment workflow:
1. Lower the take-up arm to take out the material to be cut from the wafer box, place the material to be cut on the
pre-calibration table for pre-calibration, and then send it to the working plate for dicing.
2. The upper fetching arm moves the cut material from the work plate to the cleaning plate for two-fluid cleaning and wafer drying.
3. Lower the pick arm and put the cut material back into the pre-calibration table for pre-calibration, and then push it back into the wafer box
Conditions of Use:
1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the water temperature of the cutting water to room temperature 2ºC (fluctuation range within ±1ºC), and control the cooling water temperature to be the same as room temperature (fluctuation range control within ±1ºC).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual
Application areas:
IC, optical and optoelectronics, communications, LED packaging, QFN packaging, DFN packaging, BGA packaging
Precision cutting
materials silicon
wafer, PCB board, EMC, ceramics, glass, quartz, gallium arsenide, lithium niobate, sapphire, crystal
Auto focus function:
Through the visual algorithm, coordinated with the motion control, the lens can be automatically raised and lowered, and the clear position of the workpiece image can be quickly obtained
1. who are we?
We are based in Guangdong, China, start from 2014, sell to North America(00.00%), Western Europe(00.00%), South Asia(00.00%), Southeast Asia(00.00%), Mid East(00.00%), South America(00.00%), Eastern Asia(00.00%), Northern Europe(00.00%). There are total about 11-50 people in our office.
2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;
3. what can you buy from us?
Soldering machine, Precision spot welding machine, Plasma cleaning machine, Glue dispenser, Screw machine
4. why should you buy from us not from other suppliers?
with ultra professional service and skill to provide high performance but competitive price goods, the customer's success is our own success.
5. what services can we provide?
Accepted Delivery Terms: FOB, CIF, EXW, FCA, CPT
Accepted Payment Currency: USD, EUR, HKD, CNY;
Accepted Payment Type: T/T, PayPal, Cash;
Language Spoken: English, Chinese
Minder-Hightech
The MDHYDS12B is a high precision dicing machine designed to cut large package substrate materials with ease.
Perfect for those who need to produce a large number of precision cuts in a short amount of time.
They have been in business of manufacturing production is top-quality Minder-Hightech for many years, and they are durable, reliable, and simple to use. This is no exception, and it is designed to make the process of cutting package is large materials faster and more efficient than ever before.
One of many standout options that come with this is its ability to produce cuts being incredibly precise. Made to cut through even the toughest materials with ease. The machine's higher level laser system is positioning that each cut is made with pinpoint precision.
Incredibly versatile. It is capable of cutting a variety of materials, including ceramics, cup, and film is thin. Designed for it all whether you're working with large wafers or small samples
Ease of use. The device is equipped having a control is intuitive that produces it easy to plan and adjust settings. Compact and design is lightweight it easy to move around and position in your workspace.
If you're looking for a top-of-the-line dicing machine, the MDHYDS12B from Minder-Hightech is the perfect choice.
