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  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace
  • Thermally Activated High-Vacuum Soldering Furnace

Thermally Activated High-Vacuum Soldering Furnace

Model: MDVES-300RJ

Application: Snail instruments, sensors, and infrared detectors.

MDVES-300RJ Thermally Activated High-Vacuum Soldering Furnace

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Application:

Snail instruments, sensors, and infrared detectors.

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Features:

1. This equipment is designed for the simultaneous activation and sealing of products containing getters. It supports high vacuum and high-temperature activation, as well as high and low-temperature sealing processes.

2. Utilizes a specialized lifting mechanism and thermal insulation system to ensure effective temperature differences, without affecting the secondary lid sealing process.

3. Custom tooling fixtures for different products, capable of handling large sizes and supporting mass production, thus enhancing production efficiency and output.

4. Products are placed on trays and secured using L-type clamps, with positioning accuracy of 0.02 mm both vertically and horizontally.

5. Achieves high vacuum levels up to 10^-5 Pa, ensuring 05 perfect high vacuum, high-temperature activation, and welding activation curves.

6. Suitable for uncooled infrared detection products, MEMS, gyroscopes, and other similar devices.

Soldering effect:

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Parameters:

Basic Frame

Basic Frame

Approx. 1500mm*900mm * 840mm

Chamber Height

Approx. 500mm-530mm

Observation Window

Equipped with an observation window at the front of the chamber

Weight

Approx. 500KG

Vacuum System

Vacuum Pump

Pre-stage dry pump + Molecular pump

Process Vacuum

10^-5 Pa

Activation Environment

350°C for approximately 15 minutes or more

Gas System

Process Gas

Nitrogen

Heating and Cooling System

Heating Method

Contact heating, heating rate of 120°C/min

Cooling Method

Contact cooling, cooling rate of 120°C/min

Heating Plate Materia

Alloy-coated

Heating Area

270mm - 300mm (X-axis)*270mm-300mm (Y-axis)

Heating Element

Special vacuum heating tube; temperature collected by Siemens PLC modules, and PID control via the upper computer

Temperature Range

Maximum 450°C

Temperature Control Accuracy

±1°C

Temperature Uniformity

±2.5°C

Detection Channels

4 channels

Power Requirements

380V, 50Hz, Power≤25kW

Control System

Control Method

Siemens PLC + Industrial PC

Lifting Platform

Repetition positioning accuracy of 0.02 mm, lifting stroke of 150mm

Lifting Platform Seal

Unique bellows-style sealing on the drive shaft to achieve zero leakage during shaft movement

Tooling Plate

Graphite

Number of Tooling Fixtures

Customized based on product requirements

Supporting Equipment

Standard Configuration

Vacuum dry pump, circulating chiller, molecular pump, tooling fixtures, lifting platform

Environmental Requirements

Gas Source

Gas pressure 0.5~0.8MPa

Power Supply

380V, 50Hz, Power≤25kW

Ambient Temperature

15~35°C

Relative Humidity

≤75%

Fixture schematic diagram:

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